| 摘要 |
A device for placing a ply on a substrate surface includes a vacuum manifold assembly configured for attachment to a vacuum source and a substrate seal configured to provide a substantially gas impermeable interface with the substrate surface. This device further includes a ply seal configured to provide a substantially gas impermeable interface with the ply. In this manner, vacuum applied to the vacuum manifold assembly depressurizes an area between the ply and the substrate surface. |
