发明名称 Non-rectilinear routing in rectilinear mesh of a metallization layer of an integrated circuit
摘要 Non-rectilinear routing in a rectilinear mesh. In accordance with an embodiment of the present invention, an integrated circuit comprises a first substantially continuous metallization layer. The first substantially continuous metallization layer further comprises first and second portions electrically isolated from one another. The integrated circuit includes a trace disposed between and electrically isolated from the first and second portions of the first substantially continuous metallization layer. The trace is not parallel to an edge of the integrated circuit.
申请公布号 US7755193(B1) 申请公布日期 2010.07.13
申请号 US20050274098 申请日期 2005.11.14
申请人 发明人 MASLEID ROBERT P.
分类号 H01L23/12 主分类号 H01L23/12
代理机构 代理人
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