| 发明名称 |
Laminating magnetic materials in a semiconductor device |
| 摘要 |
A technique includes forming overlaying magnetic metal layers over a semiconductor substrate. The technique includes forming at least one resistance layer between the magnetic metal layers.
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| 申请公布号 |
US7755124(B2) |
申请公布日期 |
2010.07.13 |
| 申请号 |
US20060527774 |
申请日期 |
2006.09.26 |
| 申请人 |
INTEL CORPORATION |
发明人 |
FAJARDO ARNEL M.;ANDIDEH EBRAHIM;PARK CHANGMIN;MORROW PATRICK |
| 分类号 |
H01L29/76;H01L21/00;H01L29/94 |
主分类号 |
H01L29/76 |
| 代理机构 |
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代理人 |
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