A heat dissipation device for a heat-generating electronic component includes a heat sink (10) and a fan (20) mounted on a lateral side of the heat sink. The heat sink defines a plurality of channels (162) therein. A fan holder (30) is rotatably mounted on the heat sink. The fan is fixedly mounted on the fan holder and faces towards the channels of the heat sink. An airflow generated by the fan flows through the channels of the fan. When the fan holder rotates with respect to the heat sink, an airflow direction of the fan is changed accordingly.
申请公布号
US7753107(B2)
申请公布日期
2010.07.13
申请号
US20060309534
申请日期
2006.08.18
申请人
FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.;FOXCONN TECHNOLOGY CO., LTD.