发明名称 MOS solid-state image pickup device and manufacturing method thereof
摘要 An N-type epitaxial layer 115, which is formed above an N-type semiconductor substrate 114 in each of a pixel region and a peripheral circuit region; a first P-type well 1 formed above the N-type epitaxial layer 115 in the pixel region; and light receiving regions 117, which are formed within the first P-type well 1 and each of which is a component of a photodiode, are included. The peripheral circuit region includes: second P-type wells 2, which are formed from a surface 200 of the peripheral circuit region to a desired depth and each of which is a component of an N-Channel MOS transistor; an N-type well 3 which is formed from the surface 200 of the peripheral circuit region to a desired depth and which is a component of a P-Channel MOS transistor; and a third P-type well 4 which is formed so as to have such a shape as to isolate the N-type well 3 from the N-type epitaxial layer 115 and which has a higher impurity concentration than that of the first P-type well 1.
申请公布号 US7755150(B2) 申请公布日期 2010.07.13
申请号 US20070808042 申请日期 2007.06.06
申请人 PANASONIC CORPORATION 发明人 OHTSUKA EMI;UCHIDA MIKIYA;MIYAGAWA RYOHEI
分类号 H01L27/14 主分类号 H01L27/14
代理机构 代理人
主权项
地址