发明名称 Semiconductor substrate, and semiconductor device and method of manufacturing the semiconductor device
摘要 In a semiconductor substrate 1, a plurality of semiconductor elements 2 having diaphragm structures are formed in the form of cells in the longitudinal direction and the lateral direction, and V-grooves 3 are formed by anisotropic etching continuously on only division lines 4 parallel formed in one direction, out of the division lines 4 which are orthogonal to each other and divide the respective semiconductor elements 2 individually.
申请公布号 US7754584(B2) 申请公布日期 2010.07.13
申请号 US20090570548 申请日期 2009.09.30
申请人 PANASONIC CORPORATION 发明人 KUMAKAWA TAKAHIRO
分类号 H01L21/78;H01L21/00;H01L21/44;H01L21/46;H01L21/48;H01L21/50;H01L21/768 主分类号 H01L21/78
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