| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device that fixes a semiconductor element on a lower face of an island by a simple method. <P>SOLUTION: In the method of manufacturing the semiconductor device, a semiconductor element 12A is disposed on a lower face of an island 14 through a solder cream 28A to carry out a reflow step in this state to melt the solder cream 28A. In this way, it is unnecessary to turn both sides of a lead frame including the island after the semiconductor element is fixed to an upper face of the island 14 in order to dispose the semiconductor element 12A on the lower face of the island 14. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
