发明名称 HEAT TRANSPORT DEVICE AND ELECTRONIC DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a heat transport device having high heat transport performance, and an electronic device including the heat transport device. <P>SOLUTION: The heat transport device 10 includes a container 1 of thin plate shape. A laminate 41 is provided inside the container 1. The laminate 41 includes a gas phase mesh member 21 forming a gas phase passage 11, and a liquid phase mesh member 31 forming a liquid phase passage 12. The gas phase mesh member 21 has through-holes 5 larger than the size of mesh. Since the substantial capillary tube radius of the gas phase passage 12 can be enlarged by these through-holes 5, boiling resistance, the passage resistance of the gas phase passage, and condensation resistance when the operating fluid circulates in the container 1 can be reduced. The maximum heat transport quantity Qmax of the heat transport device can thereby be increased, and as a result, the heat transport performance of the heat transport device 10 can be improved. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010151355(A) 申请公布日期 2010.07.08
申请号 JP20080328872 申请日期 2008.12.24
申请人 SONY CORP 发明人 ONIKI KAZUNAO;YAJIMA TAKASHI
分类号 F28D15/02;H01L23/427 主分类号 F28D15/02
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