发明名称 APPARATUS FOR ASSEMBLING SUBSTRATES
摘要 PURPOSE: An apparatus for assembling a substrate through the temperature control of sticky material is provided to facilitate dechucking operation of the substrate through the temperature control of the sticky material. CONSTITUTION: A substrate chuck(150) includes a plurality of sticky materials(151) in order that a substrate is chucked by adhesion. A substrate separator individually controls the temperature of sticky material and the planarity of the substrate chucked in sticky materials. The substrate separation substrate is dechucked from the sticky materials. A temperature adjusting unit(160) individually controls the temperature of sticky materials by controlling power supply to thermoelectric elements according to the sensing value of sensors.
申请公布号 KR20100079839(A) 申请公布日期 2010.07.08
申请号 KR20080138416 申请日期 2008.12.31
申请人 LIGADP CO., LTD. 发明人 SON, HYOUNG KYU;AN, HO KAP
分类号 G02F1/13;G02F1/1339;H01L21/00;H01L21/68 主分类号 G02F1/13
代理机构 代理人
主权项
地址