发明名称 |
APPARATUS FOR ASSEMBLING SUBSTRATES |
摘要 |
PURPOSE: An apparatus for assembling a substrate through the temperature control of sticky material is provided to facilitate dechucking operation of the substrate through the temperature control of the sticky material. CONSTITUTION: A substrate chuck(150) includes a plurality of sticky materials(151) in order that a substrate is chucked by adhesion. A substrate separator individually controls the temperature of sticky material and the planarity of the substrate chucked in sticky materials. The substrate separation substrate is dechucked from the sticky materials. A temperature adjusting unit(160) individually controls the temperature of sticky materials by controlling power supply to thermoelectric elements according to the sensing value of sensors. |
申请公布号 |
KR20100079839(A) |
申请公布日期 |
2010.07.08 |
申请号 |
KR20080138416 |
申请日期 |
2008.12.31 |
申请人 |
LIGADP CO., LTD. |
发明人 |
SON, HYOUNG KYU;AN, HO KAP |
分类号 |
G02F1/13;G02F1/1339;H01L21/00;H01L21/68 |
主分类号 |
G02F1/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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