| 摘要 |
PURPOSE: A liquid epoxy resin composition for under-filling a semiconductor device, and the semiconductor device using thereof are provided to secure the under-filling workability and the package reliability of the composition. CONSTITUTION: A liquid epoxy resin composition for under-filling a semiconductor device contains an epoxy resin, a hardener, and a curing accelerator. The epoxy resin is a linear epoxy resin selected from the group consisting of an epoxy resin marked with chemical formula 1, an epoxy resin marked with chemical formula 2, and an epoxy resin marked with chemical formula 3. The hardener is a polyester polyol resin marked with chemical formula 4.
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