A RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND A METHOD OF MANUFACTURING THE SAME
摘要
PURPOSE: A rigid flexible PCB and manufacturing method thereof reduce the fabrication time by being at the same time proceed the concurrent tack and molding of the in advance manufactured radio frequency shielding film. CONSTITUTION: The rigid part comprises the ductility insulating layer(110) and the stiffness insulating layer(400) having the circuit layer(130). By extending the ductility insulating layer included in the rigid part in the outside of the rigid part the flexible part is formed. The radio frequency shielding film(300) is laminated in single-side or both sides of the flexible part. The both ends is first of all in other words buried of the radio frequency shielding film to the rigid part. The radio frequency shielding film comprises the bonding layer, and the metal layer and insulating film(350).
申请公布号
KR20100079336(A)
申请公布日期
2010.07.08
申请号
KR20080137776
申请日期
2008.12.31
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
LEE, YANG JE;YANG, DEK GIN;CHONG, MYUNG GUN;KIM, BYOUNG HAG;KIM, KEUN HO;SHIN, JAE HO