发明名称 |
ANISOTROPIC CONDUCTIVE FILM COMPOSITION FOR IMPROVEMENT OF ADHESION AND ANISOTROPIC CONDUCTIVE FILM USING IT |
摘要 |
PURPOSE: An anisotropic conductive film composition is provided to obtain excellent mobility and initial adhesive force on various substrates, to prevent a peel-off phenomenon in high temperature/high humidity and a thermal shock condition, and to improve the reliability of various display devices. CONSTITUTION: An anisotropic conductive film comprises: 15-40 parts by weight of a thermoplastic resin binder; 1-10 parts by weight of a radical initiator; 1-10 parts by weight of a silane coupling agent; and 1-20 parts by weight of a conductive particle based on 100.0 parts by weight of a radial curable material. A (poly)silsesquioxane derivative of a chemical formula 1 has obtain by giving reactivity to polyhedral oligomeric silsesquioxane or (poly)silsesquioxane. The (poly)silsesquioxane derivative is used with an amount of 0.5-30 parts by weight based on 100.0 parts by weight of the radial curable material.
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申请公布号 |
KR20100077794(A) |
申请公布日期 |
2010.07.08 |
申请号 |
KR20080135836 |
申请日期 |
2008.12.29 |
申请人 |
CHEIL INDUSTRIES INC. |
发明人 |
HWANG, JA YOUNG;KIM, HYOUN YOUNG;BAE, SANG SIK;LEE, TAE HYUN;KANG, JEONG KU;UH, DONG SEON;PARK, JIN SEONG |
分类号 |
C08L83/08;C08J5/18;C08K7/16;C08L33/06 |
主分类号 |
C08L83/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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