| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed wiring board capable of improving connection reliability between a pad and a solder bump. <P>SOLUTION: A protruding portion 76B that protrudes from a resin insulation layer 42 of a pad 76 is smaller than an embedded portion 76A that is embedded in the resin insulation layer 42. Because of this, the surface area of the pad is larger than that of a flat shape. Because of this, the contact area between the pad 76 and a solder bump 78 is large and the joint strength between the pad 76 and the solder bump 78 is increased, and therefore, the connection reliability of the solder bump 78 can be improved. <P>COPYRIGHT: (C)2010,JPO&INPIT |
