| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for dividing a base material, capable of preventing any crack caused by the mechanical stress applied to a substrate even when a thin substrate is used. <P>SOLUTION: Two first layered products 10, 110 with small functional film pieces 12a, 12a... being arrayed on a supporting body 11 are affixed to a surface side and a back side of a second layered product 20 to be divided so that the functional film pieces 12a, 12a... are opposite to the surface side and the back side of the second layered product 20, respectively, and the second layered product 20 is divided without via any functional film piece 12a. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
