发明名称 ANNEALING DEVICE AND ANNEALING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an annealing device capable of stably performing annealing processing without causing a problem that light energy efficiency is low owing to a decrease in quantity of emitted light due to an influence of heat. SOLUTION: The annealing device includes: a processing chamber 1 in which a wafer W is stored; a heating sources 17 provided facing a surface of the wafer W and having a plurality of LEDs 33 irradiating the wafer W with light; a light transmission member 18 provided corresponding to the heating source 17 and transmitting light from the LED 33; a cooling member 4 supporting the light transmission member 18 on the opposite side from the processing chamber 1, provided in direct contact with the heating source 17, and having an internal space 21 supplied with a cooling medium 19; and a cooling mechanism 64 configured to vaporize the cooling medium 19 by reducing the pressure in the internal space 21 of the cooling member 4 and to cool the heating source 17 with the heat of the vaporization. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010153734(A) 申请公布日期 2010.07.08
申请号 JP20080332799 申请日期 2008.12.26
申请人 TOKYO ELECTRON LTD 发明人 YONEDA MASATAKE;KASAI SHIGERU;TANAKA KIYOSHI;SUZUKI TOMOHIRO;OYA KAZUHIRO
分类号 H01L21/26 主分类号 H01L21/26
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