发明名称 |
POLYAMIDEIMIDE RESIN, ADHESIVE AGENT, MATERIAL FOR FLEXIBLE SUBSTRATE, FLEXIBLE LAMINATE, AND FLEXIBLE PRINT WIRING BOARD |
摘要 |
A polyamide-imide resin obtained by a process comprising the step of reacting an aromatic diisocyanate with a diimide dicarboxylic acid containing 40 mol % or more of a compound represented by the following general formula (1) and 20 mol % or more of a compound represented by the following general formula (2).
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申请公布号 |
US2010170701(A1) |
申请公布日期 |
2010.07.08 |
申请号 |
US20070444234 |
申请日期 |
2007.08.20 |
申请人 |
TAKEUCHI MASAKI;MASUDA KATSUYUKI;TOMIOKA KENICHI;EJIRI TAKAKO |
发明人 |
TAKEUCHI MASAKI;MASUDA KATSUYUKI;TOMIOKA KENICHI;EJIRI TAKAKO |
分类号 |
H05K1/00;B32B15/08;C08G73/14 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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