WAFER TAPING

摘要

A method for applying tape to a substrate can include positioning a tape proximate and substantially parallel to a surface of a substrate. A pressure source can be configured to apply pressure to a region of tape smaller than the surface in both an x direction and y direction, the x and y directions being parallel to the surface and perpendicular to one another. For example, the pressure source can be a stream of fluid such as air. Pressure can be applied to a side of the tape opposite the surface in a region smaller than the surface to cause the tape to adhere to the substrate opposite the region. The region can be moved relative to the substrate in an outward radial direction while applying the pressure. The region can be moved such that no unadhered region of tape is enclosed by any adhered region of tape.