| 摘要 |
<p>PURPOSE: A semiconductor chip package is provided to reduce the size by including an input and output pad of a dual line type. CONSTITUTION: A semiconductor chip package is comprised of a core area(20) and an input and output pad(10). The input and output pads are arranged on the outside of the core area to input and output a signal from and to the input and output pad. The input and output pads are comprised of dual lines. The dual line is comprised of an inner line and an outer line. The inner line includes input and output pads of a first group. The outer line includes the input and output pads of a second group. The input and output pads of the inner line faces the input and output pad of the outer line.</p> |
