CHUCK TABLE FOR FIXING SEMICONDUCTOR PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE SAWING APPARATUS HAVING THE SAME

摘要

PURPOSE: A chuck table and a semiconductor cutting package device thereof are provided to remarkably reduce the failure rate of a semiconductor package by spraying highly pressurized cleaning solution towards the different side of a semiconductor package substrate. CONSTITUTION: A blade movement groove(120) compartmentalizes a package adhering part(110) which are formed in the surface side in order to vertically and horizontally cross between a plurality of package adhering parts. A plurality of cleaning liquid injection hole(130) enables the edge of a blade(155) to be passed during a cutting process. A cleaning liquid supply pipe(135) is connected to a plurality of cleaning liquid injection holes and includes a supply port(133) for connecting to a cleaning liquid supply part. A vacuum pipe(145) and the cleaning liquid supply pipe are formed inside a chuck table(100) for fixing a semiconductor package. The chuck table enables the liquid to be sprayed towards the different surface of the semiconductor package substrate through the liquid supply pipe.