发明名称 POLYAMIDE RESIN COMPOSITION
摘要 PURPOSE: A polyamide resin composition is provided to secure the excellent tensile strength and impact strength, and to maintain the heat deflection temperature of the composition. CONSTITUTION: A polyamide resin composition contains 100 parts of polyamide resin by weight, 10~100 parts of polystyrene resin by weight, 5~50 parts of imide/styrene grafted with maleic anhydride by weight with the weight average molecular weight of 120,000~170,000, 5~20 parts of styrene/ethylene/butylene/styrene copolymer by weight, and 0.1~2 parts of nanometer-sized inorganic filler by weight.
申请公布号 KR20100079611(A) 申请公布日期 2010.07.08
申请号 KR20080138145 申请日期 2008.12.31
申请人 KTP INDUSTRIES, INC. 发明人 PARK, JI HYUK;PARK, EUN HA;GOO, BON CHANG
分类号 C08L77/00;C08K3/00;C08L25/04;C08L51/06 主分类号 C08L77/00
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