| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor chip that suppresses an IR drop during power supply to the semiconductor chip which densely disposes input/output electrode pads with an external circuit around it, and responds to characteristic tests. <P>SOLUTION: The semiconductor chip 1 includes a plurality of first electrode pads 2 on the periphery of the major surface of a semiconductor substrate, and at least one second electrode pad 3 disposed in a region inside the first electrode pads 2. Between the first electrode pads 2, gaps are provided at least as many as the second electrode pads 3. Thus it is possible to easily connect wires with a probe card through the gaps during a characteristic test. During mounting, a wiring board 4 is used that includes first bonding pads 5 connected on the major surface to the first electrode pads 2 and second bonding pads 8 connected on the opposite surface to the second electrode pad 3, so that power is supplied to a circuit block with short wires through wire connection with the second electrode pads 3. <P>COPYRIGHT: (C)2010,JPO&INPIT |
