发明名称 CARRIER SHAPE MEASURING INSTRUMENT
摘要 PROBLEM TO BE SOLVED: To provide a shape measuring instrument capable of precisely measuring a carrier and a posture of a semiconductor wafer stored in the carrier. SOLUTION: The shape measuring instrument includes stages 12 and 20 for supporting a carrier 18 being a measurement target and a measuring part 10 for measuring a shape of the measurement target. The stages 12 and 20 have kinematic coupling pins 20a, 20b and 20c to support the measurement target by kinematic coupling. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010153885(A) 申请公布日期 2010.07.08
申请号 JP20100020253 申请日期 2010.02.01
申请人 NIKON CORP;RENESAS TECHNOLOGY CORP 发明人 SHIMIZU FUSAO;FUJII ATSUHIRO
分类号 H01L21/673;G01B11/24 主分类号 H01L21/673
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