| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin-sealed package in which positional deviation of each electronic component is eliminated by preventing or reducing warpage or bending of a sealed resin by such a way that the terminal surface of each of electronic components is set at a uniform height and each electronic component is fixed in the state of sandwiching it from up and down and is sealed with resin. <P>SOLUTION: The terminal sides of a single or plurality of electronic components 12, 14, 16 are temporarily fixed on the surface of a first support body 10 by an adhesive layer 20, a second support body 40 having an adhesive layer 42 is fixed so as to be sandwiched between the first and second support bodies so that the adhesive layer is a back side surface of the electronic component, the electronic components are sealed with resin between the first and second support bodies, the first support body 10 and the second support body 40 are removed, and an insulating resin layer 24 and a wiring layer 28 are laminated on the electronic components and the sealing resin. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
