发明名称 ELECTRODE FORMING COMPOSITION, METHOD OF MANUFACTURING CONDUCTIVE BASE MATERIAL, AND THE CONDUCTIVE BASE MATERIAL
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an electrode forming composition having a strong adhesive property to a transparent conductive film and obtaining even higher conductivity, to provide a method of manufacturing a conductive base material using the composition, and to provide the conductive base material obtained by the method. <P>SOLUTION: In the electrode forming composition made of a paste containing metal colloidal particles and a medium for dispersing the metal colloidal particles, the metal colloidal particle consists of a metal nano particle (A) and a protective colloid (B) coating the metal nano particle (A) and the protective colloid (B) is made of an organic compound (B1) having a carboxyl group and a polymer dispersant (B2). As the base material, a transparent electrode film formed on a surface of the base material and a metal film of the conductive base material formed of a metal film formed on the transparent electrode film, the electrode forming composition is sintered to be used. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010153184(A) 申请公布日期 2010.07.08
申请号 JP20080329568 申请日期 2008.12.25
申请人 MITSUBOSHI BELTING LTD 发明人 ISEDA TAISUKE;OCHI YUKIFUMI;IKUTAKE NORIKO;IWAMOTO MASAHIRO
分类号 H01B1/22;H01B1/00;H01B5/14;H01B13/00;H01L21/288;H01L31/04 主分类号 H01B1/22
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