发明名称 METHOD OF MANUFACTURING WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing wiring boards for firmly fixing discrete components for positioning, and for ensuring processing precision by preventing occurrence of uncut remainder of glass fiber. SOLUTION: In the method of manufacturing wiring boards, drilling is performed so that the periphery of a plurality of through-holes has an intersection, thus forming a continuous deformed through-hole with the plurality of through-holes and forming a projection at which the intersection of the periphery of the plurality of through-holes projects inside the periphery of the deformed through-hole. In the method, a lower hole is provided near the intersection of the periphery of the plurality of through-holes that lies within the periphery of the deformed through-hole and forms a projection of the deformed through-hole. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010153629(A) 申请公布日期 2010.07.08
申请号 JP20080330732 申请日期 2008.12.25
申请人 HITACHI CHEM CO LTD 发明人 NAKAMURA KATSUHIKO;TAZAWA KAZUYUKI
分类号 H05K3/00;B23B41/04;B26F1/16 主分类号 H05K3/00
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