| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic circuit device and a manufacturing method of the same that achieve the mounting of a cover plate with a reduced number of components while easily achieving cost reduction. SOLUTION: The manufacturing method of the electronic circuit device has the following configuration. The electronic circuit device 10 is configured as follows. A circuit board 41 stored in a board storage recess 21 of a case 20 is embedded into a resin 51 filled into the board storage recess 21. A cover plate 30 for closing an opening 22 of the board storage recess 21 is configured so that each fixing protrusion 32 protrusively formed on the cover plate 30 is embedded and fixed in the resin 51. The cover plate 30 is inserted into the board storage recess 21 of the case 20. Each fixing protrusion 32 of the cover plate 30 is embedded into a liquid resin material in the board storage recess 21 so as to fix each fixing protrusion by curing the liquid resin material. COPYRIGHT: (C)2010,JPO&INPIT
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