| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high frequency IC package for hermetically sealed surface mounting to achieve wide band and high frequency transmissions. Ž<P>SOLUTION: An input/output line of an IC chip mounted on the surface of a base 4 and loaded within a metal frame 1 is formed in a coplanar line structure. Moreover, a dielectric block for feedthrough provided with a hermetical sealing cover is separated into an upper dielectric block 2 where the entire part of the upper surface and the side surface is metallized with a conductive material and a lower dielectric block 3 where a part of the upper surface, a part of the side surface, and the entire part of the bottom surface are metallized with a conductive material, and a coplanar transmitting line 31 is formed on the upper surface of the lower dielectric block 3. In addition, the ground surface for the coplanar transmitting line 31 formed of metallization of the upper surface of the lower dielectric block 3 is connected to the bottom surface ground formed of bottom surface metallization 33 formed at the bottom surface of the lower dielectric block 3 with a ground VIA formed at the end part in the side surface of the lower dielectric block 3. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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