| 摘要 |
PURPOSE: A substrate punching device for occupying the small mounting area by reducing the entire size is provided to reduce the size of a punching device by inserting a post into a guide groove of a lower mold. CONSTITUTION: A substrate punching device comprises a main body, a lower mold, an upper mold(300), a pressing and driving unit, and a transferring unit. The lower mold is installed on the upper part of the main body. The upper mold is disposed oppositely to the lower mold. The upper mold compresses a substrate(10) between the lower mold and forms punched holes(11). The pressing and driving unit moves up and down the upper mold. The transferring unit transfers the substrate to the upper part of the lower mold. |
