| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a flip-chip mounting method that can form unevenness, in a stable shape at a part of a fillet, even when using an anisotropic conductive adhesive, and prevents water from entering an electrical connection part between a wiring substrate and a semiconductor chip, even in the usage environment of high temperature and high humidity. <P>SOLUTION: A surface of a projecting underfill resin 6 at a periphery of the semiconductor chip 1 is coated with a second resin 16b to form an uneven layer 16, and molding using a mold resin is carried out thereupon to form a container. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
