发明名称 SPUTTERING APPARATUS AND FILM DEPOSITION METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a sputtering apparatus and a film deposition method capable of executing the film deposition of high quality in a groove having an inclined wall such as a V-groove. Ž<P>SOLUTION: The sputtering apparatus comprises a rotatable cathode 102, a rotatable stage 101 and a rotatable shading plate 105. The shading plate 105 has a slit-like aperture 108, and sputtered particles can be passed therethrough via the aperture 108. In the aperture 108, the width in the direction orthogonal to the rotational direction is larger than the width in the rotational direction of the shading plate 105. Further, at least one V-groove is formed in a substrate 104 arranged on a substrate supporting surface, and the longitudinal direction of the V-groove coincides with the direction orthogonal to the rotational direction of the shading plate 105. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010150652(A) 申请公布日期 2010.07.08
申请号 JP20090168397 申请日期 2009.07.17
申请人 CANON ANELVA CORP 发明人 ENDO TETSUYA;ABARA EINSTEIN NOEL
分类号 C23C14/34 主分类号 C23C14/34
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