| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package that achieves compatibility between suppression of air bubble mixing into a bonded part and improvement in breaking strength of a package so as to have excellent reliability. SOLUTION: A semiconductor package 1 at least includes: a semiconductor substrate 10; a functional element 11 arranged on one face of the semiconductor substrate; a protective substrate 20 arranged oppositely to the one face of the semiconductor substrate at a prescribed interval from the surface of the semiconductor substrate; a first bonding member 22 arranged so as to surround the functional element and bonding the semiconductor substrate and the protective substrate to each other; and a second bonding member 23 arranged between the first bonding member and the functional element on the face, being the one face of the semiconductor substrate and surrounded by the first bonding member, and bonding the semiconductor substrate and the protective substrate to each other. COPYRIGHT: (C)2010,JPO&INPIT |
