发明名称 |
EXTRA HIGH BANDWIDTH MEMORY DIE STACK |
摘要 |
A system includes a central processing unit (CPU); a memory device in communication with the CPU, and a direct memory access (DMA) controller in communication with the CPU and the memory device. The memory device includes a plurality of vertically stacked chips and a plurality of input/output (I/O) ports. Each of the I/O ports connected to at least one of the plurality of chips through a through silicon via. The DMA controller is configured to manage to transfer of data to and from the memory device.
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申请公布号 |
US2010174858(A1) |
申请公布日期 |
2010.07.08 |
申请号 |
US20090348735 |
申请日期 |
2009.01.05 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
CHEN MING-FA;HSU CHAO-SHUN;CHAO CLINTON CHIH-CHIEH;CHEN CHEN-SHIEN |
分类号 |
G06F13/28;G06F12/00 |
主分类号 |
G06F13/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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