<p>A method of fabricating an integrated device including a MicroElectroMechanical system (MEMS) and an associated microcircuit is provided. In one embodiment, the method comprises: forming a high temperature capable contact through a dielectric layer to an underlying element of a microcircuit formed adjacent to a MicroElectroMechanical System (MEMS) structure on a substrate; and depositing a layer of conducting material over the dielectric layer, and patterning the layer of conducting material to form a local interconnect (LI) for the microcircuit overlying and electrically coupled to the contact and a bottom electrode for the adjacent MEMS structure. Other embodiments are also provided.</p>
申请公布号
WO2010077998(A1)
申请公布日期
2010.07.08
申请号
WO2009US68337
申请日期
2009.12.16
申请人
SILICON LIGHT MACHINES CORPORATION;LU, JOSHUA;BEACH, GREGORY;PAYNE, ALEXANDER;HUNTER, JAMES
发明人
LU, JOSHUA;BEACH, GREGORY;PAYNE, ALEXANDER;HUNTER, JAMES