| 摘要 |
PURPOSE: A semiconductor package device and a manufacturing method thereof are provided to improve the yield by reducing time by directly and electrically making a second semiconductor chip and a third semiconductor chip in the form of a flip chip and a first semiconductor chip and a connection possible. CONSTITUTION: A first semiconductor chip(120) bonds on a substrate(110) so that a metal wiring is located in the upper part. A second semiconductor chip(130) comprises an opposed point(201) which mutually faces with the metal wiring of the first semiconductor chip of the metal wiring. The semiconductor chip perpendicularly bonds on the top of the first semiconductor chip with conductivity. A third semiconductor chip(140) perpendicularly bonds on the top of the first semiconductor chip while the metal wiring of itself has the opposed point which mutually faces with the metal wiring of the first semiconductor chip with the conductivity.
|
