摘要 |
PURPOSE: A drive unit and a wafer plating device including the same is provided to drive a wafer by chucking using pneumatic force control. CONSTITUTION: A wafer plating device comprises a plating chamber(10), a target plate(20) and a drive unit(30). Electrolyte is accepted in the plating chamber. Anode is applied to the state dipped in electrolyte in the target plate. The drive unit rotates and chucks wafer. The driving part comprises a chucking part(31), a rotating unit(37) and a pneumatic part(42). The chucking part selectively chucks wafer. The rotating unit rotates the chucking part. The pneumatic part offers the chucking force to the chucking part.
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