发明名称 OPERATION UNIT AND WAFER PLATING APPARATUS HAVING THE SAME
摘要 PURPOSE: A drive unit and a wafer plating device including the same is provided to drive a wafer by chucking using pneumatic force control. CONSTITUTION: A wafer plating device comprises a plating chamber(10), a target plate(20) and a drive unit(30). Electrolyte is accepted in the plating chamber. Anode is applied to the state dipped in electrolyte in the target plate. The drive unit rotates and chucks wafer. The driving part comprises a chucking part(31), a rotating unit(37) and a pneumatic part(42). The chucking part selectively chucks wafer. The rotating unit rotates the chucking part. The pneumatic part offers the chucking force to the chucking part.
申请公布号 KR20100077449(A) 申请公布日期 2010.07.08
申请号 KR20080135381 申请日期 2008.12.29
申请人 K.C.TECH CO., LTD. 发明人 LEE, YOUNG HWON;LEE, DONG HOON
分类号 C25D17/00;H01L21/288 主分类号 C25D17/00
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