| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plasma etching apparatus mounted with a suction type plasma gun, and to provide a plasma etching method. <P>SOLUTION: A capillary distal end 6 of a plasma gun 2 comprising a capillary 3 and a plasma generating electrode 4 is disposed inside a sealed container 1, and an exhaust device 7 is connected to a terminal of the plasma gun 2 outside the sealed container 1. Furthermore, a gas inlet 8 is provided in the sealed container 1, and a reactive raw material gas feed unit 9 is connected to the gas inlet 8. <P>COPYRIGHT: (C)2010,JPO&INPIT |
