| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of cutting an ingot, which reduces a cutting allowance in an ingot. <P>SOLUTION: In this method of cutting an ingot, a light condensing point P is focused on an ingot 1 and then a laser light L is cast with a direction along an expected cut plane 5 as a laser light incident direction to form reformed regions 7 inside the ingot 1 along the expected cut plane 5. Thereafter, by performing etching in such a manner that etching may progress along the reformed regions 7, the ingot is cut along the expected cut plane 5. By making the laser light incident in a direction along the expected cut plane 5, the extension of the reformed regions 7 in a direction perpendicular to the expected cut plane is suppressed. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
