| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a processing apparatus which is free from problems of etching selectivity and is capable of etching away two layers at a sufficient etching speed when removing a laminate of at least two layers existing on a processing target to be processed, by wet etching. Ž<P>SOLUTION: The processing apparatus includes: a first processing liquid supply portion 15 which supplies a first processing liquid to a processing target W in a storage portion 2 and brings the first processing liquid into contact with a first film to etch the first film; a second processing liquid supply portion 17 which supplies a second processing liquid different in a state from the first processing liquid to the processing target W in the storage portion 2 and brings the second processing liquid into contact with a second film to etch the second film; a detection portion 31 which detects an etched-away state of the first film; and a control portion 32 which transmits an instruction to switch from the first processing liquid to the second processing liquid, to a switching portion 13 when determining it on the basis of a detection value of the detection portion 31 that the first film has been removed. The detection portion 31 measures a concentration of a prescribed material in the first processing liquid brought into contact with the processing target W. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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