发明名称 |
SEMICONDUCTOR DEVICE, STACKED SEMICONDUCTOR DEVICE AND INTERPOSER SUBSTRATE |
摘要 |
A semiconductor device has a semiconductor element; an interposer substrate having a wiring pattern electrically connected to the semiconductor element and an insulating substrate formed with the wiring pattern; a connection layer for adhering between the semiconductor element and the interposer substrate; and a solder ball external terminal arranged on the interposer substrate. The insulating substrate is folded in a portion mounted with the external terminal arranged on an outer side to the semiconductor element, and the unfolded and folded portions of the insulating substrate are opposite each other to form a gap therebetween.
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申请公布号 |
US2010171210(A1) |
申请公布日期 |
2010.07.08 |
申请号 |
US20100725090 |
申请日期 |
2010.03.16 |
申请人 |
HITACHI CABLE, LTD. |
发明人 |
HOSONO MASAYUKI;SHIBATA AKIJI;INABA KIMIO |
分类号 |
H01L25/065;H01L23/488;H01L23/522 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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