| 摘要 |
A semiconductor package includes: (1) a substrate including an upper surface and a lower surface opposite to the upper surface; (2) a chip mounted and electrically connected to the upper surface of the substrate; (3) an interposer mounted on the chip and electrically connected to the upper surface of the substrate, the interposer including an upper surface and a lower surface that is opposite to the upper surface and facing the chip, the interposer including a plurality of electrical contacts located on the upper surface of the interposer; and (4) a molding compound sealing the substrate, the interposer, and the chip, and exposing the lower surface of the substrate, the molding compound defining a plurality of holes that enclose and expose respective ones of the electrical contacts.
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