| 摘要 |
PURPOSE: A semiconductor device and a method of manufacture thereof are provided to arrange metal wirings the amendment plan which at least contacts the first. The metal bridge is prevented between the metal wiring. CONSTITUTION: A first PMD(Pre Metal Dielectric)(110) is formed on the semiconductor substrate(100) including the element isolation film and transistor. A plurality of first contacts(120b) is connected to the junction area of transistor. The second PMD is formed in upper part the first PMD. The first metal wiring(130) is arranged the amendment plan which at least contacts the first. The third PMD is formed on the top of the second PMD.
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