| 摘要 |
PROBLEM TO BE SOLVED: To enhance transference property and to improve durability. SOLUTION: A resin molding apparatus is provided with: a first mold; a second mold movably arranged freely forwards and backwards to the first mold and facing thereto; a transfer plate 24 with the transfer face formed of an irregular pattern, attached to one of the first and second molds toward cavity spaces C1, C2; and a heat insulating layer formed of metallic glass disposed between one of the molds and transfer plate 24. The arrangement of the heat insulating layer formed of the metallic glass between one of the molds and the transfer plate 24, allows low temperature setting for a metallic glass. The molding material after transferring is cooled and solidified in a short period of time, and the molding cycle is shortened thereby. COPYRIGHT: (C)2010,JPO&INPIT |
