| 摘要 |
The present invention discloses methods and systems for increasing polishing performance of a CMP process. In one aspect, for example, a method of increasing polishing performance of a CMP process includes vibrating a contact interface between a CMP pad and a wafer during a CMP process, such that oscillations between the CMP pad and the wafer occurs in a direction substantially parallel to a working surface of the CMP pad. In one specific aspect, vibrating the contact interface includes vibrating the contact interface in a direction substantially parallel to the contact interface. The vibrating can include vibrating the CMP pad, vibrating the wafer, or vibrating the CMP pad and the wafer. Such vibrations can allow the contact pressure at the contact interface to be decreased as compared to a contact interface that is not vibrated to minimize damage to the CMP pad or the wafer.
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