| 摘要 |
PURPOSE: A chemical and mechanical polishing device and a polishing method are provided to minimize a thickness difference between the center part and the edge part of a wafer. CONSTITUTION: A chemical and mechanical polishing device(100) comprises a measuring unit(110), a controller, and a polishing unit(120). The measuring unit measures the thickness of the center part and the edge part of a wafer. The controller compares the thickness of the center part with the thickness of the edge part of the wafer. The polishing unit polishes the surface of the wafer. |
