| 摘要 |
PURPOSE: A lead-free tin alloy electroplating composition and a method thereof are provided to create tin alloying composition having little bubbling by plating tin alloy at high current density and plating rate. CONSTITUTION: A lead-free tin alloy electroplating composition comprises one or more tin ion supply sources, one or more alloy metal supply sources, one or more flavone compounds, and one or more compositions having chemical formula HOR(R")SR'SR(R")OH. The alloy metal ion supply source is selected from a group consisting of silver ion, copper ion and bismuth ion. R, R' and R" are the same or different in the chemical formula. The composition additionally includes one or more grain refiners/stabilizer compounds. |
