| 摘要 |
<p>PURPOSE: A wafer edge exposure method and a device thereof are provided to prevent the defect of a wafer due to the degradation of illumination by adding a lot ID identification process. CONSTITUTION: A lot ID identification device(2) is arranged in a cooling system for cooling a wafer after hard bake. The lot ID identification device comprises a camera and an output part(4). The camera takes a photograph of the lot ID part of a wafer. The output part outputs the lot ID part of a wafer as an image. A wafer edge exposure I/O board(3) controls each step of a wafer edge exposure process. The wafer edge exposure I/O board stores the image outputted from the output part of the lot ID identification device in a database.</p> |
