| 摘要 |
PURPOSE: An apparatus for sucking substrate and method for chucking a substrate use the rest vacuum line in the state secluding the part in which the vacuum leakage generates. Substrate is adsorbed. CONSTITUTION: A vacuum line(204) comprises a plurality of vacuum ports(202). A vacuum pump(300) offers the vacuum pumping force to the vacuum line. On off valve controls the vacuum pumping force offered to the vacuum line. The controller(400) secludes on off valve of the vacuum line in which the vacuum leakage generates among the vacuum line. On off valve of the vacuum line in which the vacuum leakage does not generate is opened.
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