发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR MANUFACTURING ETCHED SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for obtaining a resin pattern which has good strippability while having satisfactory chemical resistance, and which exhibits good adhesiveness to a metal film on a base material, and to provide a method for manufacturing an etched substrate using such a resin pattern. <P>SOLUTION: The photosensitive resin composition includes an alkali-soluble resin (A) prepared by reacting an acid radical-containing acrylic resin with an alicyclic epoxy group-containing unsaturated compound, a polyfunctional monomer (B) having tri- or higher functionality, a nitrogen-containing monofunctional monomer (C), and a photoinitiator (D). <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010152155(A) 申请公布日期 2010.07.08
申请号 JP20080331091 申请日期 2008.12.25
申请人 TOKYO OHKA KOGYO CO LTD 发明人 UEMATSU TERUHIRO;MOMOSAWA AYA;TAKAGI TOSHIYA
分类号 G03F7/027;G03F7/028;G03F7/038;G03F7/09;G03F7/40;H05K3/06 主分类号 G03F7/027
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