| 摘要 |
<P>PROBLEM TO BE SOLVED: To properly fix an electronic component to a circuit board in a structure where a fixing agent is provided between the circuit board and the electronic component. <P>SOLUTION: The circuit device 100 has a BGA 30 which is mounted on a circuit board 12, and a shield member 20 which is arranged on the periphery of the BGA 30, wherein the BGA 30 is fixed to the circuit board 12 by making an underfill agent 40 exhibiting fluidity permeate between the circuit board 12 and the BGA 30 and then curing the underfill agent. The shield member 20 is provided with an opening 23 at a part facing the region F where the underfill agent 40 flows out toward the shield member 20. <P>COPYRIGHT: (C)2010,JPO&INPIT |
