| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a composite wiring board having high dimension accuracy, for preventing deterioration in yield and efficiently discharging void. SOLUTION: This method for manufacturing a composite wiring board includes: the steps for manufacturing a wiring board 6 having a through conductor 62 and a wiring layer 63 formed inside an insulating base 61 made of a ceramic sintered compact; manufacturing first glass ceramic green sheets 11-15, and second glass ceramic green sheets 21-24 starting baking shrink at a temperature higher than that of the green sheets; laminating the green sheets to form a glass ceramic green sheet laminate 5; laminating the wiring board 6 on the glass ceramic green sheet laminate 5: and baking the glass ceramic green sheet laminate 5 having the wiring board 6 laminated thereon at a temperature at which the second glass ceramic green sheets 21-24 are baked and shrunk but the wiring board 6 does not melt. COPYRIGHT: (C)2010,JPO&INPIT |
